COOL-SILVER G4 is the fourth generation and lower thermal resistance version, of AIT’s original COOL-SILVER thermal paste. It is a non-curing, non-silicone, thermal interface compound that is not electrically conductive. It is designed specifically for high power devices requiring less than 0.0016 ºC in²/watt thermal resistance (0.001 inch interface layer). COOL-SILVER G4 will become slightly more viscous after dispensing. It will continue to remain a thermally conductive interface medium with non-electrically conductive properties.